Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electromagnetic radiation to eliminate electron-magetic interface. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substragte can reduce internal stress and allowable tolerence, Make the terminal products have higher reliability design, and provide good solutions for electronic communication products in terms of heat conduction and electromagnetic shielding.